Three Dimensional Transient Cooling of electronic Component in an Enclosure Enhanced by Heat Sink: Part II: Parametric Study

Faculty of Engineering

Assiut University

Three Dimensional Transient Cooling of electronic Component in an Enclosure Enhanced by Heat Sink: Part II: Parametric Study

Research Authors
H. Hassan, I.S. Taha, N.Y. Abdel Shafey, and A.Y. Turk
Research Member
Hamdy Abo Ali Hassan Ibrahim
Research Year
2004
Research Journal
Journal of Engineering Science, Faculty of Engineering, Assiut University, Egyp
Research Vol
32(2)
Research Rank
2